Dual In-Line Package




<hardware> (DIL, DIP) The most common type of package for small and medium scale integrated circuits, with up to about 48 pins.

The pins hang vertically from the two long edges of the rectangular package, spaced at intervals of 0.1 inch.

The pins fit through holes in the circuit board to which they are soldered or into a socket.

[More than 48 pins?]



< Previous Terms Terms Containing Dual In-Line Package Next Terms >
DUAL-607
dual-attached
dual-homed
Dual In-Line
Dual In-line Memory Module
DIL
DIP
Dual In-Line
dual ported
dual-stack
Dual Tone Multi Frequency
DUEL
Duff's device